Flip chip carrier
封測基板載具
Specification and Material
型號規格與材質
材質多為SUS白鐵，規格依客戶需求可精密設計開發製具並規格化量產。此外，材質也提供藍鋼片等其他作為選擇。現今與多家上市公司及跨國集團合作開發製作。
Our products' material are made of SUS galvanized iron. We can pending on customers’' demand to precisely design the jig for flip chip carrier and quantity production. Besides, the material still have multiple options, such as blue steel and so on. We have cooperate with several listed companies and multinational corporations.
Product features
產品特色
根據客戶需求採個別化開發
產線量能充足，交貨順利
提供產品保固期
經過熱浸鍍光澤鉻防鏽處理且不造成形變
進階表面低溫黑鉻處理,可提高耐久度及曦光穩定性
Individualized design according to customers ‘demand
Sufficient production line capacity and delivery on time
Offer products warranty period
Received galvanizing hot dip process without deformation
Advanced low-temperature black chrome surface treatment improve durability and light stability
Cooperate development
2. 共同開發
針對高規格產品，防止晶片製成時割傷，以提高良率，
與客戶共同研發在承載區加裝peek來預防。
For high-specification products, to prevent the chip cut during packing process,
so as to improve the yield rate, we have jointly developed with the customer to install peek in the loading area to prevent it.
客製化Flip Chip封裝製程用基板載具。
Customization IC carrier for flip chip during packing process
經過光澤鉻防鏽處理且不造成形變
Received galvanizing hot dip process without deformation
進階表面低溫黑鉻處理
Advanced low-temperature black chrome surface treatment
承載區加裝peek來預防製成時割傷
Install peek in the loading area to prevent the chip cut during packing process
Main Customer
主要客戶
